Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9799778 | Chip package having a trench exposed protruding conductive pad | Ming-Chieh Huang, Hsi-Chien Lin | 2017-10-24 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9799778 | Chip package having a trench exposed protruding conductive pad | Ming-Chieh Huang, Hsi-Chien Lin | 2017-10-24 |