Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11532557 | Planar power module with spatially interleaved structure | Laili WANG, Fengtao YANG, Wei Mu, Cheng ZHAO, Jianpeng Wang | 2022-12-20 |
| 11158609 | Three-dimensional integrated package device for high-voltage silicon carbide power module | Laili WANG, Xiaodong Hou, Cheng ZHAO, Jianpeng Wang, Chengzi YANG +1 more | 2021-10-26 |