Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11823891 | Backside metallized compound semiconductor device and method for manufacturing the same | Tsung-Te CHIU, Kechuang Lin, Houng-Chi Wei, Chia-Chu Kuo | 2023-11-21 |
| 11264231 | Method for manufacturing backside metalized compound semiconductor wafer | Tsung-Te CHIU, Houng-Chi Wei | 2022-03-01 |