Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11264242 | Method and apparatus for determining expansion compensation in photoetching process, and method for manufacturing device | Changlin Zhao, Sheng HU | 2022-03-01 |
| 11069647 | Semiconductor wafer, bonding structure and wafer bonding method | Wanli GUO, Xing Hu, Yuheng Huang | 2021-07-20 |