Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12300630 | Semiconductor device package structure comprising package unit including adhesive layer | Ming-Hung Chen | 2025-05-13 |
| 11682631 | Manufacturing process steps of a semiconductor device package | Ming-Hung Chen | 2023-06-20 |
| 9549466 | Circuit board and manufacturing method thereof | Jui-Yun Fan, Hui Lu, Howard Huang | 2017-01-17 |
| 9372950 | Circuit layout method and circuit layout apparatus | Xian-Feng Mai, Hsiao-Ming Wang | 2016-06-21 |
| 9271404 | Circuit board and manufacturing method thereof | Jui-Yun Fan, Hui Lu, Howard Huang | 2016-02-23 |