Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11282722 | Chip front surface touchless pick and place tool or flip chip bonder | Zongrong Liu, Ge Yi | 2022-03-22 |
| 9293694 | Magnetoresistive random access memory cell with independently operating read and write components | Ge Yi, Shaoping Li, Dong-Yun Li, Zongrong Liu | 2016-03-22 |
| 9018100 | Damascene process using PVD sputter carbon film as CMP stop layer for forming a magnetic recording head | Yanfeng Chen, Yana Qian, Ming M. Yang, Yunfei Li, Paul E. Anderson | 2015-04-28 |
| 9012265 | Magnet assisted alignment method for wafer bonding and wafer level chip scale packaging | Ge Yi, Zongrong Liu, Shaoping Li | 2015-04-21 |
| 8413317 | Method for fabricating a structure for a microelectric device | Dujiang Wan, Hai Sun, Ge Yi, Wei-Xin Gao, Hong Zhang +4 more | 2013-04-09 |
| 8320077 | Method and system for providing a high moment film | Yun-Fei Li, Yingjian Chen | 2012-11-27 |
| 7672080 | Laminated perpendicular writer head including amorphous metal | Kyusik Sin, Yingjian Chen | 2010-03-02 |