Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6288909 | Conductive via feed through for double-sided modules | David Andrew Verdon, Brett A. Kelley | 2001-09-11 |
| 5175611 | Microwave integrated circuit package to eliminate alumina substrate cracking | Paul J. Brody | 1992-12-29 |
| 5102029 | Microwave integrated circuit package to eliminate alumina substrate cracking and method | Paul J. Brody | 1992-04-07 |