Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6521485 | Method for manufacturing wafer level chip size package | Spencer Su, James Chyi Lai, Lin Chien-Tsun, Captain Chen, Allen Chen +2 more | 2003-02-18 |
| 6459148 | QFN semiconductor package | Su Chun-Jen, Lin Chien-Tsun, Su Yu-Hsien, Tseng Ming-Hui | 2002-10-01 |
| 6337510 | Stackable QFN semiconductor package | Su Chun-Jen, Lin Chien-Tsun, Su Yu-Hsien, Tseng Ming-Hui | 2002-01-08 |