Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7645522 | Copper bonding or superfine wire with improved bonding and corrosion properties | Albrecht Bischoff, Lutz Schrapler, Frank Krüger | 2010-01-12 |
| 6352634 | Method for producing a lead-free substrate | Thomas Frey, Gunter Herklotz | 2002-03-05 |
| 5486721 | Lead frame for integrated circuits | Gunter Herklotz, Thomas Frey | 1996-01-23 |