Issued Patents All Time
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12370130 | Preparation method for powder product, powder product, and powder commodity | Jinhai Chen, Bokchul Shin, Jie Shen, Yuncai Tian, Tao Yu | 2025-07-29 |
| 11484912 | Active sorting muck-collecting device for slurry balancing shield | Jian Ma, Yunfeng Wang, Wenqi DONG, Yushuang Wang, Minghui Liu +7 more | 2022-11-01 |
| 11441214 | Low-yield-ratio ultra-high-strength high-toughness steel for pressure hulls and preparation method therefor | Qibin Ye, Liye Kan, Cheng Zhou, Qinghai Wang, Yimin Wang +1 more | 2022-09-13 |
| 11427878 | Ultrahigh-strength ultrahigh-toughness and low-density dual-phase lamellar steel plate and preparation method therefor | Xiangtao DENG, Zhaodong Wang, Hao Wu, Tianliang Fu, Jiadong LI | 2022-08-30 |
| 10065226 | Cooling method and on-line cooling system for controlled rolling with inter-pass cooling process | Zhaodong Wang, Bingxing Wang, Junyu Wu, Tian Zhang, Yi Han +3 more | 2018-09-04 |
| 8865526 | Semiconductor device and method for manufacturing a semiconductor device | Ta-Te Chou, Xian Li | 2014-10-21 |
| 8421214 | Semiconductor device and method for manufacturing a semiconductor device | Ta-Te Chou, Xian Li | 2013-04-16 |
| 8269338 | Semiconductor device having improved heat dissipation capabilities | Ta-Te Chou, Xiong Zhang, Xian Li, Hai Fu | 2012-09-18 |
| D654881 | Bridge rectifier package with heat sink | Ta-Te Chou, Xiong Zhang, Xian Li, Hai Fu | 2012-02-28 |
| 8048714 | Semiconductor device and method for manufacturing a semiconductor device having improved heat dissipation capabilities | Ta-Te Chou, Xiong Zhang, Xian Li, Hai Fu | 2011-11-01 |
| D616387 | Bridge rectifier package | Ta-Te Chou, Xiong Zhang, Xian Li, Hai Fu | 2010-05-25 |
| 7719096 | Semiconductor device and method for manufacturing a semiconductor device | Ta-Te Chou, Xiong Zhang, Xian Li, Hai Fu | 2010-05-18 |
| D573116 | Bridge rectifier package with heat sink | Ta-Te Chou, Xiong Zhang, Xian Li, Hai Fu | 2008-07-15 |