Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11876003 | Semiconductor package and packaging process for side-wall plating with a conductive film | Heinrich Karrer, Junfeng Liu, Huiying Ding, Thomas Schmidt | 2024-01-16 |
| 11764075 | Package assembly for plating with selective molding | Huiying Ding, Junfeng Liu, Heinrich Karrer, Thomas Schmidt | 2023-09-19 |
| 11450534 | Packaging process for side-wall plating with a conductive film | Heinrich Karrer, Junfeng Liu, Huiying Ding, Thomas Schmidt | 2022-09-20 |
| 11393699 | Packaging process for plating with selective molding | Huiying Ding, Junfeng Liu, Heinrich Karrer, Thomas Schmidt | 2022-07-19 |