Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7768104 | Apparatus and method for series connection of two die or chips in single electronics package | Ta-Te Chou, Hui Ding, Yun Zhang, Hong He | 2010-08-03 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7768104 | Apparatus and method for series connection of two die or chips in single electronics package | Ta-Te Chou, Hui Ding, Yun Zhang, Hong He | 2010-08-03 |