Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9117714 | Wafer level package and mask for fabricating the same | Fu-Tien Weng, Yi-Chuan Lo, Bii-Cheng Chang | 2015-08-25 |
| 7422970 | Method for modifying circuit within substrate | Wei Yu, Hsin-Sheng Liao | 2008-09-09 |