Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7485966 | Via connection structure with a compensative area on the reference plane | Sheng-Yuan Lee | 2009-02-03 |
| 7443272 | Signal transmission structure, circuit board and connector assembly structure | Sheng-Yuan Lee | 2008-10-28 |
| 7436268 | Signal transmission structure, circuit board and connector assembly structure | Sheng-Yuan Lee | 2008-10-14 |
| 7247937 | Mounting pad structure for wire-bonding type lead frame packages | Sheng-Yuan Lee | 2007-07-24 |