Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7173309 | SOI single crystalline chip structure with multi-thickness silicon layer | — | 2007-02-06 |
| 7141855 | Dual-thickness active device layer SOI chip structure | — | 2006-11-28 |
| 7081405 | Package module for an IC device and method of forming the same | — | 2006-07-25 |
| 6975002 | SOI single crystalline chip structure | Honda Huang | 2005-12-13 |
| 6971886 | LGA to PGA package adapter | — | 2005-12-06 |
| 6890186 | Socket structure for grid array (GA) packages | — | 2005-05-10 |
| 6841882 | Elastomer interposer for grid array packages and method of manufacturing the same | — | 2005-01-11 |
| 6672882 | Socket structure for grid array (GA) packages | — | 2004-01-06 |
| 6639324 | Flip chip package module and method of forming the same | — | 2003-10-28 |
| 6566166 | Method of manufacturing a cavity-down plastic ball grid array (CD-PBGA) substrate | — | 2003-05-20 |