Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12353814 | System-in-package technology-based process design method and system, medium, and device | Jihong Wu, Jishuo Liu, Fengshou Liu | 2025-07-08 |
| 12111811 | EDA pad package library updating/application method and system, medium and terminal | Fengshou Liu | 2024-10-08 |
| 12073164 | Stencil step design method and system, computer readable storage medium, and device | Jishuo Liu, Jiuxuan Liu, Yongqiang Song, Yongjian Qu | 2024-08-27 |
| 11921776 | Surface mount data conversion method, system, medium and device based on component three-dimensional database | Guoliang Qie, Jihong Wu, Yongjian Qu | 2024-03-05 |
| 11775731 | Stencil-avoidance design method and device, electronic device and storage medium | Pan Su, Dujuan Li, Jishuo Liu | 2023-10-03 |
| 11604916 | Method, system, and electronic device for detecting open/short circuit of PCB design layout | Fengshou Liu | 2023-03-14 |
| 11330705 | Method, system and apparatus for detecting polarity of component, and computer-readable storage medium | Yongjian Qu, Jishuo Liu, Fengshou Liu | 2022-05-10 |
| 10824785 | PCB stencil manufacturing method and system | Fengshou Liu, Jiuxuan Liu, Jishuo Liu | 2020-11-03 |
| 10810347 | PCBA inspection method and system based on 3D AOI and AXI | Fengshou Liu, Pan Su, Zhongliang Zhu | 2020-10-20 |
| 9791851 | Quick processing system and method for SMT equipment | Yongjian Qu, Fengshou Liu, Zhongliang Zhu | 2017-10-17 |