Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9941234 | Integrated packaging of multiple double sided cooling planar bond power modules | — | 2018-04-10 |
| 9041183 | Power module packaging with double sided planar interconnection and heat exchangers | Laura D. Marlino, Puqi Ning, Fei Wang | 2015-05-26 |
| 8380451 | System and method for monitoring the state of health of a power electronic system | Chingchi Chen, Michael W. Degner | 2013-02-19 |
| 7932800 | Method and apparatus for three-dimensional integration of embedded power module | Michele H. Lim, J. D. van Wyk | 2011-04-26 |
| 7911792 | Direct dipping cooled power module and packaging | Chingchi Chen, Michael W. Degner | 2011-03-22 |