Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5560795 | Process for manufacturing a printed circuit board and printed circuit board | Siegfried Kopnick, Werner Uggowitzer | 1996-10-01 |
| 5525181 | Method of manufacturing a multilayer printed circuit board having first and second conducting patterns connected through an adhesive layer and laminate for the manufacture of such a printed circuit board | Siegfried Kopnick, Werner Uggowitzer | 1996-06-11 |
| 5378858 | Two-layer or multilayer printed circuit board | Siegfried Kopnick, Werner Uggowitzer | 1995-01-03 |