Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10012670 | Wafer bonding method for use in making a MEMS gyroscope | Biao Zhang | 2018-07-03 |
| 9254992 | Method of making a MEMS gyroscope having a magnetic source and a magnetic sensing mechanism | — | 2016-02-09 |