Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12300578 | Aluminum nitride multilayer power module interposer and method | Stephen P. Nootens, Steven S. Scrantom | 2025-05-13 |
| 9340462 | Transient liquid phase, pressureless joining of aluminum nitride components | Jonathan H. Harris, Robert J. Tesch, Stephen P. Nootens, Sorin Dinescu, William L. Bradbury +1 more | 2016-05-17 |
| 6462413 | LDMOS transistor heatsink package assembly and manufacturing method | Stuart Weinshanker, Dana R. Graham | 2002-10-08 |
| 6250127 | Heat-dissipating aluminum silicon carbide composite manufacturing method | Jack Rubin, Michael J. Singer, Walter V. Chichra, Anthony P. Grodio, Vlad Ocher +4 more | 2001-06-26 |
| 6238454 | Isotropic carbon/copper composites | Glen B. Engle, Vladimir Ocheretyansky | 2001-05-29 |
| 6096111 | Exothermically sintered homogeneous composite and fabrication method | Ranganath Saraswati | 2000-08-01 |
| 5972737 | Heat-dissipating package for microcircuit devices and process for manufacture | Vladimir Ocheretyansky | 1999-10-26 |
| 5886407 | Heat-dissipating package for microcircuit devices | Vladimir Ocheretyansky | 1999-03-23 |
| 5878322 | Heat-dissipating substrate for micro-electronic devices and fabrication method | — | 1999-03-02 |
| 5413751 | Method for making heat-dissipating elements for micro-electronic devices | Walter V. Giniel, Terrence V. Hermes, Vladimir Ocheretyansky | 1995-05-09 |