Issued Patents All Time
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6659843 | Substrate dicing method | John N. Boucher | 2003-12-09 |
| 6354909 | Substrate dicing method | John N. Boucher | 2002-03-12 |
| 6152803 | Substrate dicing method | John N. Boucher | 2000-11-28 |
| 5934973 | Semiconductor wafer dicing saw | John N. Boucher | 1999-08-10 |
| 5819931 | Package useful in storing and handling fragile dicing blade | John N. Boucher | 1998-10-13 |
| 5718615 | Semiconductor wafer dicing method | John N. Boucher | 1998-02-17 |
| D387364 | Semiconductor wafer dicing saw | John N. Boucher | 1997-12-09 |
| 5676360 | Machine tool rotary table locking apparatus | John N. Boucher | 1997-10-14 |
| D381668 | Semiconductor wafer dicing saw | John N. Boucher | 1997-07-29 |
| 5624215 | Bowling ball drilling | John N. Boucher | 1997-04-29 |
| 5613350 | Method for packaging and handling fragile dicing blade | John N. Boucher | 1997-03-25 |
| 5427478 | Bowling ball drilling apparatus | John N. Boucher | 1995-06-27 |
| 4787362 | Abrasive blade having a polycrystalline ceramic core | John N. Boucher | 1988-11-29 |