Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12456673 | Flip chip package and substrate thereof | Chung-Kang Peng, Pi-Yu Peng, Hua-Nan Huang, Yi-Chih Lin | 2025-10-28 |
| 12456578 | Metal electrode of ceramic capacitor and method of forming the same | Hsing-I Hsiang, Fu-Su Yen, Chen-sing Huang, Kai Chun Yang, Shiang-Yu Wang | 2025-10-28 |
| 8992534 | Method and system for cutting knee joint using robot | Sung Hwan Yoon, Oh Myoung Kwon, Joon Sik Park, Hang Jae LEE, Mi Ro Kang +2 more | 2015-03-31 |