Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5078082 | Method and apparatus for applying bonding material to a populated mounting surface | — | 1992-01-07 |
| 4626478 | Electronic circuit device components having integral spacers providing uniform thickness bonding film | — | 1986-12-02 |
| 4538168 | High power semiconductor package | — | 1985-08-27 |
| 4536825 | Leadframe having severable fingers for aligning one or more electronic circuit device components | — | 1985-08-20 |
| 4514587 | High power semiconductor package | — | 1985-04-30 |
| 4443655 | Extruded semiconductor package and fabrication method | — | 1984-04-17 |