Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8288862 | Multiple die stack package | Koh Yong Chuan, Fong Kok Chin | 2012-10-16 |
| 7504715 | Packaging of a microchip device | — | 2009-03-17 |
| 7443041 | Packaging of a microchip device | — | 2008-10-28 |
| 7129115 | Packaging of a microchip device | — | 2006-10-31 |
| 7023076 | Multiple chip semiconductor packages | — | 2006-04-04 |