Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10620166 | In-plane modulus testing of materials by an ultrasonic same-side method | Ming-Yung Chen | 2020-04-14 |
| 10620167 | In-plane modulus testing of materials by an ultrasonic dry-contact method | Ming-Yung Chen | 2020-04-14 |
| 10458958 | Ultrasonic through-thickness modulus evaluation of materials | Ming-Yung Chen | 2019-10-29 |