Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5448817 | Cryogenic removal of silicon substrates from metallic heat sinks using thermal mass to cool surface mounted printed wire boards | — | 1995-09-12 |
| 5297327 | Cryogenic removal method for epoxy impregnated coils from rigid outer housings | — | 1994-03-29 |
| 5199159 | Methods for cryogenic removal of epoxy/wire field windings and for separating multi-layer printed circuit wiring boards | — | 1993-04-06 |
| 5070603 | Method of separating multi-layer printed circuit wiring boards | — | 1991-12-10 |