Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11990836 | Power supply unit and power supply system with dynamic current sharing | Chi-Hung Lin, Guo-Hua Wang, Hsien-Kai WANG | 2024-05-21 |
| 11476212 | Semiconductor contact structure having stress buffer layer formed between under bump metal layer and copper pillar | — | 2022-10-18 |
| 10903179 | Semiconductor contact structure having stress buffer layer formed between under bump metal layer and copper pillar | — | 2021-01-26 |