Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6200828 | Integrated circuit package architecture with a variable dispensed compound and method of manufacturing the same | Jacob Jeng, Edward Chen | 2001-03-13 |
| 6133067 | Architecture for dual-chip integrated circuit package and method of manufacturing the same | Jacob Jeng, Edward Chen | 2000-10-17 |
| 5684417 | Data sensing apparatus of a read only memory device | Heng-Sheng Huang | 1997-11-04 |
| 5429988 | Process for producing high density conductive lines | Heng-Sheng Huang, Wood Wu | 1995-07-04 |
| 5378646 | Process for producing closely spaced conductive lines for integrated circuits | Heng-Sheng Huang, Wood Wu | 1995-01-03 |
| 5350698 | Multilayer polysilicon gate self-align process for VLSI CMOS device | Heng-Sheng Huang, Gary Hong | 1994-09-27 |
| 5330924 | Method of making 0.6 micrometer word line pitch ROM cell by 0.6 micrometer technology | Heng-Sheng Huang, Te-Sun Wu, Han-Shen Lo | 1994-07-19 |