| 6200828 |
Integrated circuit package architecture with a variable dispensed compound and method of manufacturing the same |
Jacob Jeng, Edward Chen |
2001-03-13 |
| 6133067 |
Architecture for dual-chip integrated circuit package and method of manufacturing the same |
Jacob Jeng, Edward Chen |
2000-10-17 |
| 5684417 |
Data sensing apparatus of a read only memory device |
Heng-Sheng Huang |
1997-11-04 |
| 5429988 |
Process for producing high density conductive lines |
Heng-Sheng Huang, Wood Wu |
1995-07-04 |
| 5378646 |
Process for producing closely spaced conductive lines for integrated circuits |
Heng-Sheng Huang, Wood Wu |
1995-01-03 |
| 5350698 |
Multilayer polysilicon gate self-align process for VLSI CMOS device |
Heng-Sheng Huang, Gary Hong |
1994-09-27 |
| 5330924 |
Method of making 0.6 micrometer word line pitch ROM cell by 0.6 micrometer technology |
Heng-Sheng Huang, Te-Sun Wu, Han-Shen Lo |
1994-07-19 |