Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10927000 | MEMS structure with an etch stop layer buried within inter-dielectric layer | Li-Che Chen, Te-Yuan Wu, Chia-Huei Lin, Hui-Min Wu, Kuan-Yu Wang +1 more | 2021-02-23 |
| 9499399 | Method for forming MEMS structure with an etch stop layer buried within inter-dielectric layer | Li-Che Chen, Te-Yuan Wu, Chia-Huei Lin, Hui-Min Wu, Kuan-Yu Wang +1 more | 2016-11-22 |
| 8936960 | Method for fabricating an integrated device | Kuan-Yu Wang, Hui-Min Wu | 2015-01-20 |
| 8525354 | Bond pad structure and fabricating method thereof | Hui-Min Wu, Ming-I Wang, Kuan-Yu Wang, Chien-Hsin Huang | 2013-09-03 |