Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9558996 | Method for filling trench with metal layer and semiconductor structure formed by using the same | Chi-Mao Hsu, Hsin-Fu Huang, Min-Chuan Tsai, Chien-Hao Chen, Wei-Yu Chen +3 more | 2017-01-31 |
| 8860135 | Semiconductor structure having aluminum layer with high reflectivity | Chi-Mao Hsu, Hsin-Fu Huang, Min-Chuan Tsai, Chien-Hao Chen, Wei-Yu Chen +3 more | 2014-10-14 |
| 8609228 | High performance sealable coextruded biaxially oriented polypropylene film | Yong Chen, Hongyu Chen, Xiao Bing Yun, Morgan M. Hughes, Rajen M. Patel | 2013-12-17 |