Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9075103 | Test structure for wafer acceptance test and test process for probecard needles | Qiong Wu | 2015-07-07 |
| 7741198 | Method for fabricating a probing pad of an integrated circuit chip | — | 2010-06-22 |
| 7456479 | Method for fabricating a probing pad of an integrated circuit chip | — | 2008-11-25 |