Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9974186 | Method of manufacturing printed circuit board with embedded electronic components positioned by using solder paste | Ming Yi Yeh, Kun Chi Chen, Hung-Min Chen | 2018-05-15 |
| 9443743 | Method for directly attaching dielectric to circuit board with embedded electronic devices | Ming Yi Yeh, Kun Chi Chen, Hung-Min Chen | 2016-09-13 |
| 8302299 | Method of manufacturing a multilayer printed circuit board with a built-in electronic device | Cheng-Hsien Chou, Kun Chi Chen, Hung-Min Chen | 2012-11-06 |