Issued Patents All Time
Showing 26–32 of 32 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6108208 | Testing assembly having a pressed joint with a single layer of thermal conductor which is reused to sequentially test multiple circuit modules | Jerry Ihor Tustaniwskyj | 2000-08-22 |
| 5918665 | Method of thermal coupling an electronic device to a heat exchange member while said electronic device is being tested | Jerry Ihor Tustaniwskyj | 1999-07-06 |
| 5844208 | Temperature control system for an electronic device in which device temperature is estimated from heater temperature and heat sink temperature | Jerry Ihor Tustaniwskyj | 1998-12-01 |
| 5821505 | Temperature control system for an electronic device which achieves a quick response by interposing a heater between the device and a heat sink | Jerry Ihor Tustaniwskyj | 1998-10-13 |
| 4999311 | Method of fabricating interconnections to I/O leads on layered electronic assemblies | John Dzarnoski | 1991-03-12 |
| 4980002 | Method of fabricating a layered electronic assembly having compensation for chips of different thickness and different I/O lead offsets | John Dzarnoski | 1990-12-25 |
| 4959749 | Layered electronic assembly having compensation for chips of different thickness and different I/O lead offsets | John Dzarnoski | 1990-09-25 |