Issued Patents All Time
Showing 1–15 of 15 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8648134 | Polymer processing aids | Jeffrey Jacob Cernohous, Hayder Zahalka, Keith A. Hughes | 2014-02-11 |
| 7781500 | Coupling agents for natural fiber-filled polyolefins | — | 2010-08-24 |
| 7731880 | Cellulosic-thermoplastic composite and method of making the same | Robert G. Rowland, Mark Richardson | 2010-06-08 |
| 7635731 | Cellulosic-thermoplastic composite and method of making the same | Robert G. Rowland, Mark Richardson | 2009-12-22 |
| 6939903 | Natural fiber-filled polyolefin composites | Roger A. Cheney, Louis Panzer, Henry L. Mei | 2005-09-06 |
| 6101308 | Composition for encapsulating signal transmission devices | Thomas Peter | 2000-08-08 |
| 5940570 | Composition for encapsulating signal transmission devices | Thomas Peter | 1999-08-17 |
| 5698631 | Epoxy resin compositions for encapsulating signal transmission devices | Thomas Peter | 1997-12-16 |
| 5140075 | Epoxy-modified encapsulation composition | Richard F. Tomko, Revati Ranganathan, Dong-Hak Bae | 1992-08-18 |
| 5128086 | Epoxy-modified encapsulation composition | Richard F. Tomko, Revati Ranganathan, Dong-Hak Bae | 1992-07-07 |
| 4919976 | Insulating adhesive tape composition and composites thereof | Frank C. Cesare, Robert G. Davis | 1990-04-24 |
| 4818789 | Moisture-curable low molecular weight polymers and compositions and composites thereof | Richard F. Tomko, Thomas S. Coolbaugh | 1989-04-04 |
| 4787703 | Cable containing epoxy-modified encapsulation composition | Richard F. Tomko, Revati Ranganathan, Dong-Hak Bae | 1988-11-29 |
| 4767814 | Moisture-curable halosilane-substituted polymer composition | Dong-Hak Bae, William M. Cummings | 1988-08-30 |
| 4759992 | Process for coating moisture-curable low molecular weight polymers and composites thereof | Richard F. Tomko, Thomas S. Coolbaugh | 1988-07-26 |