Issued Patents All Time
Showing 1–17 of 17 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11968788 | Fixing belt of wearable device, method for manufacturing the same, and wearable device | Yong Yang | 2024-04-23 |
| 11058014 | Method of manufacturing circuit board with embedded conductive circuits | Xiao Zhang | 2021-07-06 |
| 10993327 | Circuit board and method for manufacturing the same | Lin Gao, Yong Yang | 2021-04-27 |
| 10772217 | Circuit board and method for manufacturing the same | Lin Gao | 2020-09-08 |
| 10764992 | Circuit board and method for manufacturing the same | Yong-Chao Wei, Lin Gao | 2020-09-01 |
| 10555420 | Circuit board and method for manufacturing the same | Yong Yang | 2020-02-04 |
| 10462902 | Circuit board and manufacturing method | Lin Gao, Yong Yang, Yong-Chao Wei | 2019-10-29 |
| 10349518 | Circuit board and method for manufacturing the same | Yong-Chao Wei | 2019-07-09 |
| 9320143 | Touch member and method of manufacturing the same | Cheng-Ming Weng, Wei-Ming Cheng | 2016-04-19 |
| 9288917 | Manufacturing method for multi-layer circuit board | Pei-Chang Huang, Cheng-Po Yu | 2016-03-15 |
| 9198303 | Manufacturing method for multi-layer circuit board | Pei-Chang Huang, Cheng-Po Yu, Ai-Hwa Lim | 2015-11-24 |
| 9095083 | Manufacturing method for multi-layer circuit board | Pei-Chang Huang, Cheng-Po Yu | 2015-07-28 |
| 9074051 | Dianhydride monomer having side chain, polyimide compound having side chain and manufacturing method thereof | — | 2015-07-07 |
| 9045597 | Polyimide compound having side chain and manufacturing method thereof | — | 2015-06-02 |
| 8436254 | Method of fabricating circuit board structure | Cheng-Po Yu | 2013-05-07 |
| 7987589 | Multilayer three-dimensional circuit structure and manufacturing method thereof | Cheng-Hung Yu | 2011-08-02 |
| 7700986 | Chip package carrier and fabrication method thereof | Chih-Peng Fan | 2010-04-20 |