CY

Chih-Kuei Yang

UT Unimicron Technology: 1 patents #166 of 284Top 60%
Overall (All Time): #3,147,057 of 4,157,543Top 80%
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Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
8373265 Package substrate having a through hole and method of fabricating the same — 2013-02-12