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Cheng-Pin Chien

UT Unimicron Technology: 1 patents #166 of 284Top 60%
📍 New Taipei, TW: #6,529 of 10,472 inventorsTop 65%
Overall (All Time): #3,268,208 of 4,157,543Top 80%
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Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
8049114 Package substrate with a cavity, semiconductor package and fabrication method thereof Kuo-Ching Chen, Tsung-Yuan Chen 2011-11-01