YI

Yukihiro Isa

UJ Umc Japan: 3 patents #3 of 9Top 35%
📍 Tateyama, JP: #7 of 24 inventorsTop 30%
Overall (All Time): #1,599,538 of 4,157,543Top 40%
3
Patents All Time

Issued Patents All Time

Showing 1–3 of 3 patents

Patent #TitleCo-InventorsDate
6959485 Bump ball crimping apparatus — 2005-11-01
6911387 Bump forming method and apparatus for heating and compressing bump materials inserted in positioning holes — 2005-06-28
6774652 Cantilever type probe card and method for production thereof — 2004-08-10