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Mrinal K. Bera

UA Uchicago Argonne: 1 patents #458 of 1,009Top 50%
Overall (All Time): #2,973,225 of 4,157,543Top 75%
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Patent #TitleCo-InventorsDate
9809903 Methods for top-down fabrication of wafer scale TMDC monolayers Saptarshi Das, Andreas Roelofs, Mark Antonio 2017-11-07