TN

Takeshige Nakayama

UI Ube Industries: 10 patents #88 of 1,686Top 6%
UB Ube: 3 patents #1 of 72Top 2%
GL Gunze Limited: 1 patents #132 of 349Top 40%
Overall (All Time): #364,231 of 4,157,543Top 9%
13
Patents All Time

Issued Patents All Time

Showing 1–13 of 13 patents

Patent #TitleCo-InventorsDate
12330981 Polyimide precursor resin composition for forming flexible device substrate Norio Miura, Kazutaka Narita 2025-06-17
12176543 Polyimide-based binder for power storage device, electrode mixture paste, negative electrode active material layer, negative electrode sheet for power storage device, and power storage device Kazutaka Narita 2024-12-24
11532819 Electrode binder resin composition, electrode mix paste, and electrode Tetsuo Sakai, Masanori Morishita 2022-12-20
11407857 Method for producing aqueous polyimide precursor solution composition Susumu Takasaki, Tomonori Nakayama, Kensuke Hiroshige 2022-08-09
11407868 Method for producing aqueous polyimide precursor solution composition Susumu Takasaki, Tomonori Nakayama, Kensuke Hiroshige 2022-08-09
11401418 Method for producing aqueous polyimide precursor solution composition Tomonori Nakayama, Susumu Takasaki, Akira Kawabata, Kenji Sonoyama 2022-08-02
10511025 Electrode manufacturing method Tomonori Nakayama, Naoki Kitayama 2019-12-17
10056614 Polyimide binder for power storage device, electrode sheet using same, and power storage device Koji Abe, Shuichi Koso 2018-08-21
9685654 Method for producing electrode Tomonori Nakayama, Naoki Kitayama 2017-06-20
9418772 Binder resin composition for electrode, electrode mixture paste, and electrode Tomonori Nakayama, Seiichirou Takabayashi, Tetsuji Hirano 2016-08-16
9187676 Production process of polyimide film laminate, and polyimide film laminate Tomonori Nakayama, Kenji Sonoyama 2015-11-17
8816017 Process for producing polyamic acid solution and polyamic acid solution Seiichirou Takabayashi, Tooru Murakami 2014-08-26
8686106 Polyamic acid solution composition having carbon black dispersed therein, process for production of semiconductive polyimide resin belt using the composition, and semiconductive polyimide resin belt Naoki Nishiura, Akira Ichino, Takashi Kuraoka, Toru Murakami 2014-04-01