MP

Ming Pan

TC T.Y.C. Brother Industrial Co.: 4 patents #6 of 66Top 10%
UC University Of Cincinnati: 1 patents #288 of 791Top 40%
📍 Guoxing Township, OH: #1 of 1 inventorsTop 100%
Overall (All Time): #822,978 of 4,157,543Top 20%
6
Patents All Time

Issued Patents All Time

Showing 1–6 of 6 patents

Patent #TitleCo-InventorsDate
10985300 Encapsulation method for flip chip Quan Ke, Futing Yi 2021-04-20
7118928 Method of forming a semiconductor phosphor layer by metalorganic chemical vapor deposition for use in light-emitting devices Andrew J. Steckl 2006-10-10
D472001 Tail light Benny Shen 2003-03-18
D471303 Tail light Yau-Yuan Kuo 2003-03-04
D469898 Tail light Ju Wu 2003-02-04
D464751 Tail light Chia-Yu Chang 2002-10-22