Issued Patents All Time
Showing 1–17 of 17 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7066378 | Filling device | — | 2006-06-27 |
| 6995321 | Etched hole-fill stand-off | Bruce Lee | 2006-02-07 |
| 6923882 | Compliant pre-form interconnect | Nancy Iwamoto, Stephen L. Tisdale | 2005-08-02 |
| 6921505 | Hole filling using an etched hole-fill stand-off | Bruce Lee | 2005-07-26 |
| 6855385 | PCB support plate for PCB via fill | Charles W. Lewis, Joseph Schug | 2005-02-15 |
| 6840425 | Scavenging system | — | 2005-01-11 |
| 6832714 | Heated filling device | Timothy Meyer | 2004-12-21 |
| 6814918 | Filling method | — | 2004-11-09 |
| 6800232 | PCB support plate method for PCB via fill | Charles W. Lewis, Joseph Schug | 2004-10-05 |
| 6797224 | Heated filling method | Timothy Meyer | 2004-09-28 |
| 6793852 | Scavenging method | — | 2004-09-21 |
| 6506332 | Filling method | — | 2003-01-14 |
| 6454154 | Filling device | — | 2002-09-24 |
| 6312621 | Via fill formulations which are electrically and/or thermally conductive, or non-conductive | Nancy Iwamoto, Alan Grieve, Xiao-Qi Zhou | 2001-11-06 |
| 5859110 | Method of decreasing bleed from organic-based formulations and anti-bleed compostitions | Nancy Iwamoto | 1999-01-12 |
| 5783621 | Method of decreasing bleed fom organic-based formulations and anti-bleed compositions | Nancy Iwamoto | 1998-07-21 |
| 5744533 | Adhesive composition for bonding a semiconductor device | Nancy Iwamoto, Shao-Wei Li, Alan Grieve | 1998-04-28 |