SW

Shuidi Wang

TU Tsinghua University: 1 patents #1,221 of 2,815Top 45%
Overall (All Time): #2,938,620 of 4,157,543Top 75%
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Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
9613925 Method for bonding semiconductor devices on sustrate and bonding structure formed using the same Jian Cai, Ziyu Liu, Qian Wang, Yang Hu, Yu-Hsien Chen 2017-04-04