Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5977627 | Packaging construction for very large scale integrated-circuit chips | — | 1999-11-02 |
| 5315481 | Packaging construction for semiconductor wafers | — | 1994-05-24 |
| 5311058 | Integrated circuit power distribution system | — | 1994-05-10 |
| 5019945 | Backplane interconnection system | — | 1991-05-28 |
| 5007843 | High-density contact area electrical connectors | — | 1991-04-16 |
| 5007841 | Integrated-circuit chip interconnection system | — | 1991-04-16 |
| 4847731 | Liquid cooled high density packaging for high speed circuits | — | 1989-07-11 |
| 4733172 | Apparatus for testing I.C. chip | — | 1988-03-22 |
| 4581679 | Multi-element circuit construction | — | 1986-04-08 |
| 4574331 | Multi-element circuit construction | — | 1986-03-04 |