Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6028007 | Low cost hermetic sealed microwave module packaging | Steven S. Chan, Jason Snodgress | 2000-02-22 |
| 5956840 | Low cost hermetic sealed microwave module packaging | Steven S. Chan, Jason Snodgress | 1999-09-28 |
| 5541565 | High frequency microelectronic circuit enclosure | Jeffrey Edwards, Duncan M. Smith | 1996-07-30 |
| 5402003 | Low dielectric constant interconnect for multichip modules | George W. McIver, Paula R. Hurt | 1995-03-28 |