| 11646246 |
Method of fabricating a glass substrate with a plurality of vias |
Roupen Leon Keusseyan |
2023-05-09 |
| 11251109 |
Filling materials and methods of filling through holes of a substrate |
Roupen Leon Keusseyan |
2022-02-15 |
| 10798920 |
Tracking and monitoring with geo-fencing |
— |
2020-10-13 |
| 10292370 |
Tracking and monitoring of animals with combined wireless technology and geo-fencing |
— |
2019-05-21 |
| 9374892 |
Filling materials and methods of filling through holes for improved adhesion and hermeticity in glass substrates and other electronic components |
Roupen Leon Keusseyan |
2016-06-21 |
| 9337060 |
Filling materials and methods of filling through holes for improved adhesion and hermeticity in glass substrates and other electronic components |
Roupen Leon Keusseyan |
2016-05-10 |
| 9236274 |
Filling materials and methods of filling through holes for improved adhesion and hermeticity in glass substrates and other electronic components |
Roupen Leon Keusseyan |
2016-01-12 |
| 9184064 |
System and method for metallization and reinforcement of glass substrates |
Roupen Leon Keusseyan, Charles Thomas Tucker, Jr. |
2015-11-10 |
| 9184135 |
System and method for metallization and reinforcement of glass substrates |
Roupen Leon Keusseyan, Charles Thomas Tucker, Jr. |
2015-11-10 |
| 9111917 |
Low cost and high performance bonding of wafer to interposer and method of forming vias and circuits |
— |
2015-08-18 |