Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11646246 | Method of fabricating a glass substrate with a plurality of vias | Roupen Leon Keusseyan | 2023-05-09 |
| 11251109 | Filling materials and methods of filling through holes of a substrate | Roupen Leon Keusseyan | 2022-02-15 |
| 10798920 | Tracking and monitoring with geo-fencing | — | 2020-10-13 |
| 10292370 | Tracking and monitoring of animals with combined wireless technology and geo-fencing | — | 2019-05-21 |
| 9374892 | Filling materials and methods of filling through holes for improved adhesion and hermeticity in glass substrates and other electronic components | Roupen Leon Keusseyan | 2016-06-21 |
| 9337060 | Filling materials and methods of filling through holes for improved adhesion and hermeticity in glass substrates and other electronic components | Roupen Leon Keusseyan | 2016-05-10 |
| 9236274 | Filling materials and methods of filling through holes for improved adhesion and hermeticity in glass substrates and other electronic components | Roupen Leon Keusseyan | 2016-01-12 |
| 9184064 | System and method for metallization and reinforcement of glass substrates | Roupen Leon Keusseyan, Charles Thomas Tucker, Jr. | 2015-11-10 |
| 9184135 | System and method for metallization and reinforcement of glass substrates | Roupen Leon Keusseyan, Charles Thomas Tucker, Jr. | 2015-11-10 |
| 9111917 | Low cost and high performance bonding of wafer to interposer and method of forming vias and circuits | — | 2015-08-18 |