Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 4943686 | Seal frame and method of use | — | 1990-07-24 |
| 4748495 | High density multi-chip interconnection and cooling package | — | 1988-05-31 |
| 4603345 | Module construction for semiconductor chip | James Cheng Lee, Gene M. Amdahl, Carlton G. Amdahl, Robert J. Beall, Anthony F. Matouk +1 more | 1986-07-29 |
| 4597029 | Signal connection system for semiconductor chip | John C. Marshall, James Cheng Lee, Carlton G. Amdahl, Leo Yuan | 1986-06-24 |