Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12057409 | Electronic package and manufacturing method thereof | Chih-Hsien Chiu, Wen-Jung Tsai, Chien-Cheng Lin, Ko-Wei Chang, Yu-Wei Yeh +1 more | 2024-08-06 |
| 6429827 | Integrated MMDS antenna with reflector mounted on a totally sealed single-body dipole-transceiver base | Chien-Ping Hsueh, Yung-Li Huang, Ching-Yen Hsiao, Tai-Mo Wang | 2002-08-06 |
| 6127986 | Integrated down-converter with dipole-antenna implemented with novel mechanical filter structure | Charles Hung-Pin WEN, Feng WANG | 2000-10-03 |
| 5982336 | Structure of super integrated down converter (SIDC) with dual band mechanical and notch filters | Charles Hung-Pin WEN, Feng-Ren Wang | 1999-11-09 |