CY

Cheng-Jun Yang

TS Tpk Advanced Solutions: 1 patents #72 of 164Top 45%
Overall (All Time): #2,702,126 of 4,157,543Top 65%
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Patent #TitleCo-InventorsDate
11538752 Contact area structure with organic adhesive layer between inorganic conductive layer and transparent conductive layer Chia-Jui Lin, Kuo-Lung Fang, Jun Chen 2022-12-27