Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8277597 | Method for bonding high heat conductive insulating resin | — | 2012-10-02 |
| 7446406 | Circuit device and manufacturing method thereof | Takahito Mizuno, Shigeru Wakita | 2008-11-04 |